| 1. |
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BSI BS EN 61709 |
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1997-FEB-15 • 现用 •
Electronic Components — Reliability — Reference Conditions for Failure Rates and Stress Models for Conversion-AMD 10390: July 2000
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| 2. |
. |
DIN DIN IEC 61709 |
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2008-AUG-01 • 待定/草稿 •
(DRAFT) Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 56/1264/CD:2008)
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| 3. |
. |
CENELEC EN 61709 |
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1998-APR-01 • 现用 •
Electronic Components - Reliability - Reference Conditions for Failure Rates and Stress Models for Conversion-IEC 61709:1996
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| 4. |
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DIN DIN EN 61709 |
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1999-JAN-01 • 现用 •
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 61709:1996); German version EN 61709:1998
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| 5. |
. |
IEC 61709 |
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1996-OCT-01 • 现用 •
Electronic Components - Reliability - Reference Conditions for Failure Rates and Stress Models for Conversion-First Edition
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| 6. |
. |
BSI BS 5760-18 |
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1997-FEB-15 • 非最新 •
Reliability of Systems, Equipment and Components; Part 18: Reference Conditions for Failure Rates of Electronic Components and Stress Models for Conversion-Amd 1; RENUMBERED AS BS EN 61709:2000; IEC 1709:1996;
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| 7. |
. |
DS DS/EN 61709 |
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1998-JUN-30 • 现用 •
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
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| 8. |
. |
DS DSF/FprEN 61709 |
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Date NA • 待定/草稿 •
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
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