This guide is applicable to the use of seals in specific operating environments used in the fabrication of semiconductor devices. The guide will aid in defining the seal parameters for the various process environments. It includes those elastomeric seals that come in contact with process liquids and or gases.

This guide does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this guide to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Purpose

The purpose of this document is to introduce a basic guide for the use of seals in semiconductor fabrication equipment. Also, to introduce the diverse chemical and physical requirements for the many process applications, and to reduce cost of ownership and improve up-time through the use of appropriate sealing materials. It is important that equipment users, suppliers, OEMs, and seal manufacturers use the same terminology and that communication can take place at the same level so that actual performance of the equipment can be discussed.