The criteria detailed in this specifiication apply to the following package outlines registered with, or specified by JEDEC (see Publication 95), EIAJ, or MIL-STD-1835 specifications:

Chip Carriers (Leadless or Leaded)

Dual-in-Line Packages (Sidebrazed)

Flat Packs (Top or Bottom Brazed)

Grid Arrays (Land/Ball or Pin)

NOTE 1: Packages not meeting these specifications may also use the criteria as appropriate.

This document consolidates the criteria for all cofired packages so that package amnufacturing and inspection may be simplified and costs reduced.

Purpose

— This specification defines the materials and acceptance criteria for high-temperature, cofired ceramic packages.