描述[文件摘要]

Applicability — This guideline applies to equipment used to manufacture, measure, assemble, and test semiconductor products.

Contents — This document contains the following sections:

Purpose

Scope

Limitations

Referenced Standards and Documents

Terminology

Safety Philosophy

General Provisions

Evaluation Process

Documents Provided to User

Hazard Warning Labels

Safety Interlock Systems

Emergency Shutdown

Electrical Design

Fire Protection

Heated Chemical Baths

Ergonomics and Human Factors

Hazardous Energy Isolation

Mechanical Design

Seismic Protection

Automated Material Handlers

Environmental Considerations

Exhaust Ventilation

Chemicals

Ionizing Radiation

Non-Ionizing Radiation and Fields

Lasers

Sound Pressure Level

Related Documents

Appendix 1 — Enclosure Openings

Appendix 2 — Design Guidelines for Equipment Using Liquid Chemicals

Appendix 3 — Ionizing Radiation Test Validation

Appendix 4 — Non-Ionizing Radiation (Other than Laser) and Fields Test Validation

Appendix 5 — Fire Protection: Flowchart for Selecting Materials of Construction

Appendix 6 — Laser Data Sheet – SEMI S2

Precedence of Sectional Requirements — In the case of conflict between provisions in different sections of this guideline, the section or subsection specifically addressing the technical issue takes precedence over the more general section or subsection.

NOTICE: This safety guideline does not purport to address all of the safety issues associated with its use. It is the responsibility of the users of this safety guideline to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This safety guideline is intended as a set of performance-based environmental, health, and safety (EHS) considerations for semiconductor manufacturing equipment.