This standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. However, this standard has been written so that injection-molded plastic FOSBs can be manufactured in conformance with it, and those can be utilized for maintaining wafers quality during transportation, opening and closing the door.

This standard assumes that the FOSB is used in the last process in wafer manufacturing, in acceptance and inspection, and in transferring the wafers from the FOSB to a FOUP, FOBIT or open cassette inside an IC manufacturing facility. The FOSB is not intended to be used in IC manufacturing processes. It is recommended that wafers be transferred from the FOSB to a FOUP, FOBIT or open cassette using automated methods. As described in ¶ 5.4, the purchaser needs to specify which type of FOSB door is required:

Manual door as described in ¶ 5.4.1; or

Automated–shippable door as described in ¶ 5.4.2.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This standard specifies the front-opening shipping box (FOSB) used to ship 300 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.

NOTE 1: Refer to SEMI silicon wafer related specifications M-series such as SEMI M1 as for a wafer quality.