描述[文件摘要]

This standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and inter-changeability at all mechanical interfaces. Only the physical interfaces for FOBIT are specified; no materials requirements or micro-contamination limits are given. However, this standard has been written so that both metal and injection-molded plastic FOBITs can be manufactured in conformance with it.

This standard assumes that the FOBIT is intended for use in the interfactory transportation of wafers. The following boundary conditions were used in the creation of this specification:

• Minimizing the pitch between wafers will reduce the cost of transporting wafers.

• The FOBIT will be used for interfactory transportation of both processed and unprocessed wafers.

• The box will have a 25 wafer capacity.

• Random access of wafers, using edge grip handling devices, is not a requirement for this standard

• The FOBIT will be compatible with the following 300 mm Standards:

• 13-wafer FIMS Interface (SEMI E62)

• 300 mm Load Port (SEMI E15.1)

• Kinematic Coupling (SEMI E57)

• The FOBIT will not necessarily be compliant with the following 300 mm Standards due to wafer restraint requirements and product applications during transportation:

• 300 mm Front-Opening Unified Pod (SEMI E47.1)

• 300 mm Open Cassette (SEMI E1.9)

• 300 mm Front-Opening Shipping Box (SEMI M31)

• The technical requirements of this standard are written for the transportation of nominal thickness wafers, as defined by SEMI M1.15.

This reduced-pitch, 25 capacity FOBIT is designed for use with the 13 capacity FIMS interface, as specified in SEMI E62.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This standard partially specifies a reduced-pitch front-opening box for interfactory transport of 300 mm wafers (FOBIT). This reduced-pitch box, with a capacity of 25 wafers but with the approximate physical volume of a 13 wafer FOUP, is intended to reduce the cost of transporting wafers between IC manufacturing sites. To leverage current industry 300 mm technology, this reduced-pitch front-opening box is intended to interface with 13 wafer FIMS, as specified in SEMI E62.