| 1. |
. |
TECHAMERICA GEIA-HB-0005-1 |
|
|
2006-JUN-01 • 现用 •
Program Management/Systems Engineering Guidelines For Managing The Transition To Lead-Free Electronics
|
|
| 2. |
. |
TECHAMERICA GEIA-HB-0005-3 |
|
|
2008-SEP-01 • 现用 •
Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems
|
|
| 3. |
. |
DIN DIN IEC 60068-2-83 |
|
|
2007-SEP-01 • 待定/草稿 •
(DRAFT) Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
|
|
| 4. |
. |
DIN DIN IEC 60068-2-83 |
|
|
2007-SEP-01 • 待定/草稿 •
(DRAFT) Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
|
|
| 5. |
. |
TECHAMERICA GEIA-HB-0005-2 |
|
|
2007-NOV-01 • 现用 •
Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and F inishes
|
|
| 6. |
. |
TECHAMERICA GEIA-STD-0005-1 |
|
|
2006-JUN-01 • 现用 •
Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder
|
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| 7. |
. |
DI-MGMT-81772 |
|
|
2009-JUN-12 • 现用 •
Lead-Free Control Plan (LFCP)
|
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| 8. |
. |
IPC J-STD-006B |
|
|
2008-JUN-01 • 现用 •
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications-Incorporates Amendment A1 and A2: October 2009
|
|
| 9. |
. |
ASTM B 828 |
|
|
2002-OCT-10 • 现用 •
Standard Practice for Making Capillary Joints by Soldering of Copper and Copper Alloy Tube and Fittings
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| 10. |
. |
DS DS/EN 61188-5-5 |
|
|
2007-DEC-05 • 现用 •
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
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