| 1. |
. |
ECA 534 |
|
|
1989-JAN-01 • 现用 •
Ceramic Capacitor Applications Guide Soldering and Solderability Maintenance of Leaded Electronic Components
|
|
| 2. |
. |
IPC 7351A |
|
|
2007-FEB-01 • 现用 •
Generic Requirements for Surface Mount Design and Land Pattern Standard-Contact IHS Customer Service to obtain Zip file (1-800-447-3352)
|
|
| 3. |
. |
IPC 7351A GERMAN |
|
|
2007-FEB-01 • 现用 •
Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie-Contact IHS Customer Service to obtain Zip file (1-800-447-3352)
|
|
| 4. |
. |
IPC CM-770E |
|
|
2004-JAN-01 • 现用 •
Guidelines for Printed Board Component Mounting
|
|
| 5. |
. |
IPC J-STD-006B |
|
|
2008-JUN-01 • 现用 •
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications-Incorporates Amendment A1 and A2: October 2009
|
|
| 6. |
. |
SEMI G50 |
|
|
1989-JAN-01 • 现用 •
SPECIFICATION FOR CO-FIRED CERAMIC FINE PITCH LEADED AND LEADLESS CHIP CARRIER PACKAGE CONSTRUCTIONS
|
|
| 7. |
. |
AWS BRH |
|
|
2007-JAN-01 • 现用 •
Brazing Handbook -Fifth Edition
|
|
购物车