| 1. |
. |
SEMI MS2 |
|
|
2009-NOV-01 • 现用 •
TEST METHOD FOR STEP HEIGHT MEASUREMENTS OF THIN FILMS
|
|
| 2. |
. |
SEMI MS4 |
|
|
2009-NOV-01 • 现用 •
STANDARD TEST METHOD FOR YOUNG’S MODULUS MEASUREMENTS OF THIN, REFLECTING FILMS BASED ON THE FREQUENCY OF BEAMS IN RESONANCE
|
|
| 3. |
. |
SEMI MS5 |
|
|
2007-NOV-01 • 现用 •
TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES
|
|
| 4. |
. |
BSI BS EN 62047-3 |
|
|
2006-NOV-30 • 现用 •
Semiconductor devices — Micro-electromechanical devices — Part 3: Thin film standard test piece for tensile testing
|
|
| 5. |
. |
CENELEC EN 62047-3 |
|
|
2006-SEP-01 • 现用 •
Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
|
|
| 6. |
. |
DS DS/EN 62047-3 |
|
|
2006-DEC-19 • 现用 •
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
|
|
| 7. |
. |
IEC 62047-3 |
|
|
2006-AUG-01 • 现用 •
Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing-Edition 1.0
|
|
| 8. |
. |
ASTM E 2244 |
|
|
2005-NOV-01 • 现用 •
Standard Test Method for In-Plane Length Measurements of Thin, Reflecting Films Using an Optical Interferometer
|
|
| 9. |
. |
ASTM E 2245 |
|
|
2005-NOV-01 • 现用 •
Standard Test Method for Residual Strain Measurements of Thin, Reflecting Films Using an Optical Interferometer
|
|
| 10. |
. |
ASTM E 2246 |
|
|
2005-NOV-01 • 现用 •
Standard Test Method for Strain Gradient Measurements of Thin, Reflecting Films Using an Optical Interferometer
|
|
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