| 1. |
. |
AFNOR NF C96-315 |
|
|
1987-JUL-01 • 现用 •
Microwave microelectronics. Attenuators and loads.
|
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| 2. |
. |
AFNOR NF EN ISO 10692-1 |
|
|
2001-DEC-01 • 现用 •
Gas cylinders - Gas cylinder valve connections for use in the micro-electronics industry - Part 1 : outlet connections
|
|
| 3. |
. |
AFNOR NF EN ISO 10692-2 |
|
|
2001-DEC-01 • 现用 •
Gas cylinders - Gas cylinder valve connections for use in the microelectronics industry - Part 2 : specification and type testing for valve to cylinder connections
|
|
| 4. |
. |
AFNOR UTE C96-415 |
|
|
1986-SEP-01 • 现用 •
Electronic components. Glossary of terms used in hybrid microelectronics.
|
|
| 5. |
. |
ASTM F 71 |
|
|
1968-AUG-15 • 已撤销 •
Standard Practice for Using the Morphological Key for the Rapid Identification of Fibers for Contamination Control in Electron Devices and Microelectronics
|
|
| 6. |
. |
ASTM F 127 |
|
|
1984-JAN-27 • 已撤销 •
STANDARD DEFINITIONS OF TERMS RELATING TO PHOTOMASKING TECHNOLOGY FOR MICROELECTRONICS-(Discontinued 1993; No Replacement)
|
|
| 7. |
. |
ASTM F 459 |
|
|
2006-JAN-01 • 现用 •
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
|
|
| 8. |
. |
ASTM F 677 |
|
|
2004-MAR-01 • 现用 •
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
|
|
| 9. |
. |
ASTM F 1227 |
|
|
1989-MAY-26 • 已撤销 •
Standard Test Method for Total Mass Loss of Materials and Condensation of Outgassed Volatiles on Microelectronics-Related Substrates-(Discontinued 2000; No Replacement)
|
|
| 10. |
. |
ASTM F 1238 |
|
|
1995-SEP-15 • 现用 •
Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
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