| 1. |
. |
ARMY A-A-59543 CANC NOTICE 1 |
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2005-FEB-14 已取消
SCREEN, HALFTONE, CONTACT, FOR PHOTOLITHOGRAPHY
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| 2. |
. |
ARMY ARMY TM 5-245 |
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1970-JUL-01 现用
OFFSET PHOTOLITHOGRAPHY AND MAP REPRODUCTION
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| 3. |
. |
GOST R 8.640 |
|
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2008-JAN-01 现用
State system for ensuring the uniformity of measurements. Radiometers of ultraviolet radiation measurements for photolithography technological processes testing. Verification methods
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| 4. |
. |
ARMY MIL-S-40034B CANC NOTICE 1 |
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2000-MAY-22 已取消
SCREENS, HALFTONE, CONTACT, FOR PHOTOLITHOGRAPHY
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| 5. |
. |
DS DS/EN 62047-2 |
|
|
2006-DEC-19 现用
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
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| 6. |
. |
DS DS/EN ISO 11553-1 |
|
|
2009-JAN-14 现用
Safety of machinery - Laser processing machines - Part 1: General safety requirements
|
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| 7. |
. |
DS DSF/FprEN 62047-6 |
|
|
Date NA 待定/草稿
Semiconductor devices - Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials
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| 8. |
. |
DS DSF/prEN 62047-6 |
|
|
Date NA INAC-DOBS
Semiconductor devices - Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials
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| 9. |
. |
DS DSF/prEN ISO 11553-1 |
|
|
Date NA 待定/草稿
Safety of machinery - Laser processing machines - Part 1: General safety requirements (ISO 11553-1:2005)
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| 10. |
. |
IEC 62047-2 |
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|
2006-AUG-01 现用
Semiconductor devices – Micro-electromechanical devices – Part 2: Tensile testing method of thin film materials-Edition 1.0
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