| 1. |
. |
DS DS/EN 61967-2 |
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|
2005-NOV-22 • 现用 •
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
|
|
| 2. |
. |
DS DS/EN 61967-5 |
|
|
2003-JUL-08 • 现用 •
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz - 1 GHz - Part 5: Measurement of conducted emission - Workbench Faraday Cage method
|
|
| 3. |
. |
GMW GMW15267 |
|
|
2007-JUL-01 • 现用 •
General Specification for Electromechanical Plug-In, Printed Circuit Board, and Solid-State Relays-English
|
|
| 4. |
. |
IPC 1065 |
|
|
2005-JAN-01 • 现用 •
Material Declaration Handbook
|
|
| 5. |
. |
IPC TM-650 2.5.5.7 |
|
|
2004-MAR-01 • 现用 •
Characteristic Impedance of Lines on Printed Boards by TDR-Revision A
|
|
| 6. |
. |
NEMA ICS 4 |
|
|
2005-JAN-01 • 现用 •
Terminal Blocks
|
|
| 7. |
. |
SAE J1752-3 |
|
|
2003-JAN-01 • 现用 •
(R) Measurement of Radiated Emissions from Integrated CircuitsTEM/Wideband TEM (GTEM) Cell Method; TEM Cell (150 kHz to 1 GHz), Wideband TEM Cell (150 kHz to 8 GHz)
|
|
| 8. |
. |
JSA JIS B 0144 |
|
|
2000-DEC-20 • 现用 •
PCB (printed circuit board) assembly robots - Vocabulary
|
|
| 9. |
. |
JSA JIS B 8460 |
|
|
2002-FEB-20 • 现用 •
PCB (printed circuit board) assembly robots - Presentation of characteristics and functions
|
|
| 10. |
. |
JSA JIS B 8461 |
|
|
2002-FEB-20 • 现用 •
PCB (printed circuit board) assembly robots - Interfaces
|
|
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