| 1. |
. |
DS DSF/FprEN 61760-3 |
|
|
Date NA • 待定/草稿 •
Surface mounting technology -- Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
|
|
| 2. |
. |
DS DS/EN 60749-20-1 |
|
|
2009-JUL-03 • 现用 •
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
|
|
| 3. |
. |
DS DS/EN 61188-5-4 |
|
|
2007-DEC-05 • 现用 •
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
|
|
| 4. |
. |
DS DS/EN 62137-1-4 |
|
|
2009-MAR-11 • 现用 •
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
|
|
| 5. |
. |
DS DS/EN 62137-1-5 |
|
|
2009-JUL-03 • 现用 •
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
|
|
| 6. |
. |
DS DSF/FprEN 62137-1-4 |
|
|
Date NA • 待定/草稿 •
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test
|
|
| 7. |
. |
DS DSF/FprEN 62137-1-5 |
|
|
Date NA • 待定/草稿 •
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-5: Mechanical shear fatigue test
|
|
| 8. |
. |
DS DSF/prEN 62137-1-4 |
|
|
Date NA • INAC-DOBS •
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints -- Part 1-4: Cyclic bending test
|
|
| 9. |
. |
DS DSF/prEN 62137-1-5 |
|
|
Date NA • INAC-DOBS •
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test
|
|
| 10. |
. |
ECA EIA/ECA-364-56D |
|
|
2008-FEB-28 • 现用 •
TP-56D RESISTANCE TO SOLDERING HEAT TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS
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