| 1. |
. |
IPC 7351A |
|
|
2007-FEB-01 • 现用 •
Generic Requirements for Surface Mount Design and Land Pattern Standard-Contact IHS Customer Service to obtain Zip file (1-800-447-3352)
|
|
| 2. |
. |
IPC 7351A GERMAN |
|
|
2007-FEB-01 • 现用 •
Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie-Contact IHS Customer Service to obtain Zip file (1-800-447-3352)
|
|
| 3. |
. |
IPC HDBK-005 |
|
|
2006-JAN-01 • 现用 •
Guide to Solder Paste Assessment-Companion to IPC J-STD-005
|
|
| 4. |
. |
NASA NASA-STD-8739.2W/CHG 1 |
|
|
1999-AUG-31 • 现用 •
WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY
|
|
| 5. |
. |
NASA NASA-STD-8739.3W/CHG 3 |
|
|
1997-DEC-15 • 现用 •
SOLDERED ELECTRICAL CONNECTIONS
|
|
| 6. |
. |
ECA CB-11 |
|
|
1986-JAN-01 • 现用 •
Surface Mounting of Multilayer Ceramic Chip Capacitors, Guidelines for
|
|
| 7. |
. |
ECA EIA/ECA-797 |
|
|
2007-SEP-01 • 现用 •
Aluminum-Electrolytic Capacitor Application Guideline
|
|
| 8. |
. |
IPC CM-770E |
|
|
2004-JAN-01 • 现用 •
Guidelines for Printed Board Component Mounting
|
|
| 9. |
. |
IPC D-279 |
|
|
1996-JUL-01 • 现用 •
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
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